Packaging and packaging of the hottest epcgen2 sma

Packaging and packaging of EPC Gen2 smart tag

a Gen 2 smart tag includes the following parts: semiconductor chip, processed in the chip, with sufficient data storage capacity to meet the requirements of EPC code; The antenna is made of conductive material, so that the chip can not only receive data from the RFID reader, but also send data to the reader; The antenna is printed on the substrate, and the chip is also adhered to the substrate; The label panel covers the RFID inlay and provides an easy to read printing area; Release the liner as the bottom layer of the inlay "sandwich"; Adhesive, adhesive inlay and panel, also adhesive release pad and inlay, release pad and surface plate

decomposition of each layer of Gen 2 tag containing EPC code

as shown in the figure: the first three parts constitute RFID inlay, which will take weeks to manufacture. Then it will be delivered to the label processor in rolls, and they will complete four to six steps in turn, which will take another one to three weeks. These steps mean that the production and delivery process takes weeks. In order to meet the requirements of the sudden increase in demand, it will take several months to adjust production and may lead to out of stock. Therefore, in short, familiarity with the manufacturing process of Gen 2 RFID chips, inlays and labels can help us better manage manufacturing time and delivery time with large errors

semiconductor manufacturing process

the whole process of integrated circuit (IC) includes 20 to 30 steps to locate transistors, wires and all modules. In TI's latest clean room, people use the cutting-edge 130 nm process node technology to manufacture Gen 2 usable ICs. This technology is faster than the old process node technology in producing smaller, stronger and more power-saving high-capacity chips

once the IC is ready, the assembly process unit of the inlay; Mm from the calibration of the chip bump, the bump is generally micron in diameter, and the printed landing pad is adhered to the inlay. There are electrical connections between each bump and between the bump and the digital circuit, and the digital circuit constitutes the available IC of Gen-2. The bump is protected by a piece of high-strength epoxy resin to ensure good conductivity

antenna design

when products containing EPC Gen 2 labels are delivered to retailers, they are of various sizes, shapes, raw materials and densities. This product difference may lead to corresponding changes in RF characteristics, which will greatly affect the performance of Gen 2 smart labels of products or cartons

it takes a lot of time to design, construct and test a Gen 2 antenna to achieve the optimal configuration

in response to changes in the Gen 2 smart tag supply chain, the inlay supplier may provide three or more inlays. Technology suppliers, including Ti, may have to manufacture specific inlays and antennas to meet customer needs

the steps involved in manufacturing chips in Gen 2 chips and designing various antennas are complex. The more accurate the information semiconductor manufacturers and label processors get about their needs and forecasts from end users, the stronger their ability to plan according to market demand

inlay reel and packaging design

g (2) check whether the gasket at the joint is completely en 2. The next step in the smart label supply chain is to transport the inlay to the label processor in roll form. It is important that label processors' existing embedded devices are configured to receive products in the form of volumes. Carefully wind the inlay on the reel to avoid damage, which is a key process in the final step of inlay production. The number of inlays on each reel should also be accurately calculated to avoid the outer inlay crushing the chip of the inner inlay

tag packaging

in order to form the final RFID tag, the tag processor inserts a flexible inlay containing IC and etched metal or printed RFID antenna between the surface sheet and the pad of the tag. After testing, the inlay and adhesive are bonded together, and the adhesive covers the back of the pressure-sensitive surface sheet. After inserting the inlay, the liner was stuck to the surface sheet again and cut into the required label size. All products in the store were wrapped in green

source: HC360 Huicong printing industry channel