Packaging and shipping of the hottest components

Packaging and shipping of components (Part 1)

the emergence of semiconductor materials converted into electronic functional components has triggered a revolution in electronic system design. With the reduction in size and cost of electronic functional components, the demand for them has expanded rapidly. Today, hundreds of millions of integrated circuits (ICS) are manufactured, assembled and shipped around the world to support systems used in almost every aspect of daily life. The assembly of circuit board has evolved into a production line with super automation, high speed and high output. The packaging methods and materials used for the transportation and distribution of IC must ensure that the components arrive at the mounting point of the automatic assembly line without damage and have the correct suction position. So far, the industry has adopted 2.2.1 selection and characteristics of a/d converters for transportation semiconductor ICs. There are three basic structures of a/d conversion chips: magazine, tray and tape and reel

application

magazine (shipping pipe) - main component containers: the magazine is composed of transparent or translucent polyethylene (PVC, polyvinylchloride) materials, extruded into an applicable standard shape that meets the current industrial standards. The strip size provides appropriate component positioning and orientation for industry standard automatic assembly equipment. The strips are packed and transported in the form of a combination of the number of individual strips. The combined strips are put into instant containers (bags and boxes) to form a standard quantity, which is convenient for operation and order simplification (Figure 1). The typical instant packaging quantity of the strip varies with the number of pins and the type of packaging (Table 1)

table I Examples of standard packing quantity of sliver

tubular packing products

number of pins

number of tubes

standard number of containers

class

Packing

PDIP

P>

8

50

1000

n

14

25

1000

n

16

25

1000

n

20

1000

n

24

15

750

tray (tray) -Main component containers: trays are made of carbon powder or fiber materials, which are selected based on the maximum temperature rate of the dedicated tray. Pallets designed for components that require exposure to high temperatures (moisture sensitive components) have a temperature resistance of usually 150 ° C or higher. The tray is cast into a rectangular standard shape, including a concave matrix with two kinds of healing agents in contact at the fracture position. The recess holds the element and provides protection for the element during transportation and handling. The bay provides accurate component positions for standard industrial automated assembly equipment used for mounting during circuit board assembly. The packaging and transportation of pallets are in the form of a combination of individual pallets, which are then stacked and bundled together, with a certain rigidity. An empty cover tray is placed on the loaded components and stacked trays

the typical pallet stacking structure is five full pallets and one empty cover pallet (5+1), ten full pallets and one empty cover pallet (10+1). Customers can receive single or multiple stacked units, depending on individual requirements. The components are arranged in the tray, which meets the standard industrial specifications; The standard direction is to place the first pin in the beveled corner of the tray. Figure 2 is an example of JEDEC tray shape and standard component orientation. The number of standard packages varies according to the package size of the components. Table 2 shows an example of tqpf type packaging and its standard quantity shipped in pallets

Table 2. Examples of standard quantity of pallet packaging IC

pallet packaging products

pin count

number of plates

tray matrix

standard number of containers

class

packaging

tqfp

pm

64

160

8 x 20

800

pn

80

119

7 x 17

499 5

pca

100

90

6 x 15

360

pz

100

90

6 x 15

360

tape and reel -Main component containers: typical coil structures are designed to meet modern industrial standards. There are two generally accepted standards for covering coil packaging structures. EIA-481 is applied to embossed structures, while eia-468 is applied to components with radial leads. So far, the most popular structure for active IC is embossed tape

embossed tape and reel: most active ICs are shipped in the structure of embossed tape and reel. The structure is composed of a carrier tape with a cover tape (Fig. 3). This kind of combined belt is rolled on a disc after loading components. The tape tray is put into the corrugated transport box for transportation and delivery. The three elements of this packaging structure are loading belt, cover belt and reel

carrier tape: Figure 4 shows the basic shape and dimension label of the loading belt. Generally, the loading belt is made of polystyrene (PS) or polystyrene laminated sheets. The film thickness of bit forming is 0.2~0.4mm, which depends on the size and weight of the components loaded on the belt. The design of the charging belt is mainly determined by the length, width and thickness of the components. Element size is the basis of industrial size variables of the loading belt:

A0 = size of the design receiving element width

B0 = size of the design receiving element length

K0 = size of the design receiving element thickness

for pits with bases or by mixing polyamide 6 with special amorphous polyamide or polyamide copolymer to improve its processing performance, specify K1 size to confirm the required base height. W = size that defines the total width of the loading belt. This must meet acceptable industry standards (8/12/16/24/32/44/56mm)

p1 = define the spacing between the centers of adjacent pits. This dimension must comply with industry standards (4-mm increments). Table 3 lists the basic dimensions and standard quantities of some packages in the coil structure with examples

table III Examples of industrial standard quantity of IC with coil structure packaging

mm

class

packaging

number of pins

number

diameter of disc

A0

B0

K0

K1

P1

W

SOIC

Dr

8

2500

330

6.4

5.2

2.1

n/a

8

12

dr

14

2500

330

6.5

9

2.1

n/a

8

16

dr

16

2500

330

6.5

10.3

2.1

N/A

8

16

DWR

16

2000

330

11.1

10.85

2.65

2.35

12

16

DWR

20

2000